Package structure

ABSTRACT

A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application is a continuation application of Ser. No. 17/141,635filed on Jan. 5, 2021 and entitled “PACKAGE STRUCTURE”, which acontinuation-in-part of U.S. patent application Ser. No. 16/009,005,field on Jun. 14, 2018 now issued, as patent number U.S. Ser. No.10/916,685B2. The entirety of the above-mentioned patent application ishereby incorporated by reference herein and made as a part of thisspecification.

FIELD OF THE DISCLOSURE

The present disclosure relates to a package structure; in particular, toa package structure.

BACKGROUND OF THE DISCLOSURE

A conventional package structure is provided with a package compoundfully filled in a space defined by a wall of the conventional packagestructure.

SUMMARY OF THE DISCLOSURE

The present disclosure relates to a package structure, and moreparticularly to a package structure capable of increasing theperformance.

In one aspect, the present disclosure provides a package structureincludes a substrate, a pair of electrodes, a lighting unit, a wall, anda package compound. The pair of electrodes is disposed on the substrate.The lighting unit includes a light emitting diode disposed on thesubstrate and is electrically connected to the pair of electrodes. Thewall is disposed on the substrate. The wall and the substrate jointlydefine an accommodating space, and the lighting unit is disposed in theaccommodating space. The package compound is disposed in theaccommodating space such that a top end of the package compound has aW-shaped cross section and the lighting unit is embedded in the packagecompound. The package compound has a surrounding portion around alateral surface of the light emitting diode, and the surrounding portionhas a concave top surface with an annular slot formed thereon. A bottomend of the annular slot is located at a position aligning with about 25%to 90% of a thickness of the lighting unit along a height directionperpendicular to a top surface of the lighting unit. A center ofcurvature of the concave top surface is located outside of theaccommodating space such that light emitted from the concave top surfaceis gathered outside of the wall. The top end of the package compound isexposed to air.

In certain embodiments, the package compound includes no scattering orreflecting particles.

In certain embodiments, the configuration of the package compound allowslight emitted from the light emitting diode to leave the packagestructure through the package compound without being scattered orreflected inside the accommodating space.

In certain embodiments, a height of a top end of the surrounding portionin contact with the wall is higher than a height of a top surface of thelight emitting diode.

In certain embodiments, the lighting unit is arranged at a center of thepackage compound and the surrounding portion is formed symmetricallyabout an attaching portion.

In certain embodiments, the package compound includes an attachingportion, and the attaching portion adheres to a top surface of the lightemitting diode and contacts with the surrounding portion. A top end ofthe attaching portion and a top end of the surrounding portion incontact with the wall are substantially arranged at the same height withrespect to the substrate.

In certain embodiments, the package structure includes a light-permeablecover disposed on a top end of the wall.

In certain embodiments, the light emitting diode is configured to emit alight having a wavelength within a range from about 180 nm to 410 nm.

In certain embodiments, the lighting unit includes a submount, and thelight emitting diode electrically connects to a pair of electrodes ofthe submount.

In another aspect, the present disclosure provides a package structure.The package structure includes a substrate, a pair of electrodes, alighting unit, a wall, and a package compound. The pair of electrodes isdisposed on the substrate. The lighting unit is disposed on thesubstrate and is electrically connected to the pair of the electrodes.The wall is disposed on the substrate. The wall and the substratejointly define an accommodating space, and the lighting unit is disposedin the accommodating space. The package compound is disposed in theaccommodating space. The package compound covers the lighting unit. In across section view, the package compound is in a W-shape that includes aconvex portion on a top of the lighting unit and two concave portions onlateral sides of the lighting unit, and the two concave portions contactthe convex portion. Each of the two concave portions has a concave topsurface, and a center of a curvature of the concave top surface isarranged outside of the accommodating space. A space is defined betweenthe top surface of the package compound and the wall is hollow.

In certain embodiments, a bottom end of concave top surface is locatedat a position aligning with about 25% to 90% of a thickness of thelighting unit.

In certain embodiments, the package compound includes no scattingparticles or reflecting particles.

In certain embodiments, the configuration of the package compound allowslight emitted from the light emitting diode to leave the packagestructure through the package compound without being scattered orreflected inside the accommodating space.

In certain embodiments, each of the two concave portions has a top endin contact with the wall, and a height of the top end is higher than aheight of a top surface of the light emitting diode.

In certain embodiments, the lighting unit is arranged at a center of thepackage compound and the two concave portions are formed symmetricallyabout an attaching portion.

In certain embodiments, a height of a top end of the convex portion withrespect to the substrate is less than a height of the wall with respectto the substrate.

In certain embodiments, the package structure includes a light-permeablecover deposed on a top end of the wall.

In certain embodiments, the light emitting diode is configured to emit alight having a wavelength within a range from about 180 nm to 410 nm.

In certain embodiments, the lighting unit includes a submount, and thelight emitting diode electrically connects to a pair of electrodes ofthe submount.

Therefore, the present disclosure provides a package structure to solvethe drawbacks associated with conventional package structures, therebyincreasing the performance of the package structure (e.g., a lightingefficiency) through particular configuration of a package compound.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thefollowing detailed description and accompanying drawings, wherein:

FIG. 1A is a schematic view showing step S110 of a manufacturing methodof a package structure according to a first embodiment of the presentdisclosure;

FIG. 1B is a schematic view showing step S110′ of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 2 is a first schematic view showing step S120 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 3 is a second schematic view showing step S120 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 4 is a third schematic view showing step S120 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 5 is a schematic view showing step S130 of the manufacturing methodaccording to the first embodiment of the present disclosure;

FIG. 6 is a schematic view showing steps S130 and S140 of themanufacturing method according to the first embodiment of the presentdisclosure;

FIG. 7 is a schematic view showing step S140 of the manufacturing methodaccording to the first embodiment of the present disclosure;

FIG. 8 is a schematic view showing step S150 of the manufacturing methodaccording to the first embodiment of the present disclosure;

FIG. 9 is a schematic view showing steps S150 and S160 of themanufacturing method according to the first embodiment of the presentdisclosure;

FIG. 10 is a schematic view showing step S160 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 11 is a first schematic view showing step S170 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 12 is a second schematic view showing step S170 of themanufacturing method according to the first embodiment of the presentdisclosure;

FIG. 13 is a third schematic view showing step S170 of the manufacturingmethod according to the first embodiment of the present disclosure;

FIG. 14A is a schematic view showing the package structure according tothe first embodiment of the present disclosure;

FIG. 14B is a schematic view showing the package structure in anotherconfiguration according to the first embodiment of the presentdisclosure;

FIG. 15A is a schematic view showing a package structure according to asecond embodiment of the present disclosure;

FIG. 15B is a schematic view showing the package structure in anotherconfiguration according to the second embodiment of the presentdisclosure;

FIG. 16 is a schematic view showing a package structure according to athird embodiment of the present disclosure;

FIG. 17 is a cross-sectional schematic view of a package structureaccording to a fourth embodiment of the present disclosure;

FIG. 18 is a cross-sectional schematic view of a package structureaccording to a fifth embodiment of the present disclosure;

FIG. 19 is a cross-sectional schematic view of a package structureaccording to a sixth embodiment of the present disclosure;

FIG. 20 is a cross-sectional schematic view of a first conventionalpackage structure; and

FIG. 21 is a cross-sectional schematic view of a second conventionalpackage structure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Reference is made to FIGS. 1A to 14, which illustrate a first embodimentof the present disclosure. The present embodiment discloses a packagestructure 100 and a manufacturing method thereof. In the presentembodiment, the package structure 100 is an ultraviolet light-emittingdiode for example, but the present disclosure is not limited thereto. Inorder to easily realize the package structure 100, the presentembodiment discloses the manufacturing method thereof, and thendiscloses the structure and connection relationship of each component ofthe package structure 100.

As shown in FIGS. 1A to 13, the manufacturing method of the presentembodiment includes steps S110˜S170. However, in other embodiments ofthe present disclosure, any one of the steps S110˜S170 can be omitted orchanged by a reasonable step according to design requirements.

As shown in FIG. 1A, the step S110 is carried out by providing a carriermodule M. The carrier module M includes a substrate assembly 10, aplurality of pairs of electrodes 2, a plurality of solder pad layers 3,a plurality of lighting diodes 4, and a plurality of annular walls 5. Inthe present embodiment, each pair of electrodes 2 is an electrode layer2 for example, and each of the lighting diodes 4 is an ultravioletlight-emitting diode chip for example, but the present disclosure is notlimited thereto. Specifically, the substrate assembly 10 includes aplurality of substrates 1 (as shown in FIG. 5) that are integrallyformed as a one-piece structure and are connected to each other along afirst direction D1 and a second direction D2 perpendicular to the firstdirection D1. Moreover, each of the substrates 1 has a first surface 11and a second surface 12 opposite to the first surface 11. Each of thefirst surface 11 and the second surface 12 is substantially parallel tothe first direction D1 and the second direction D2 (as shown in FIG. 5).

The electrode layers 2 are respectively disposed on the first surfaces11 of the substrates 1, and the walls 5 are respectively disposed on thefirst surfaces 11 of the substrates 1. The lighting diodes 4 arerespectively disposed in the space surrounded by the walls 5, and thelighting diodes 4 are arranged to respectively correspond in position tothe first surfaces 11 of the substrates 1. The solder pad layers 3 arerespectively disposed on the second surfaces 12 of the substrates 1.

The electrode layer 2, the lighting diode 4, and the solder pad layer 3,which are disposed on the same substrate 1, are electrically connectedto each other. Specifically, each of the substrates 1 is provided with aplurality of conductive pillars 13 embedded therein. An end of each ofthe conductive pillars 13 is exposed from the first surface 11 of thesubstrate 1 and is connected to the electrode layer 2, and another endof each of the conductive pillars 13 is exposed from the second surface12 of the substrate 1 and is connected to the solder pad layer 3, suchthat the electrode layer 2 and the solder pad layer 3 are electricallyconnected to each other through the conductive pillars 13.

Moreover, the electrical connection manner between the lighting diode 4and the electrode layer 2 can be adjusted or changed according to designrequirements. For example, as shown in FIG. 1A, the lighting diode 4 isconnected to a submount 7 fixed on the electrode layer 2 in a flip-chipbonding manner, and the submount 7 is electrically connected to theelectrode layer 2 in a wiring manner for establishing the electricalconnection between the lighting diode 4 and the electrode layer 2. Orthe lighting diode 4 can be directly mounted on the electrode layer 2for establishing the electrical connection therebetween.

As shown in FIGS. 2 to 4, the step S120 is carried out by implementing adispensing process to each space inside of the walls 5 by using adispenser G. As shown in FIG. 2, in each of the dispensing processes,the dispenser G outputs a package compound 6 toward a top surface 41 ofthe lighting diode 4 so as to form an attaching portion 61 arranged onthe top surface 41 of the lighting diode 4. As shown in FIG. 3, thepackage compound 6 further flows from a peripheral part of the attachingportion 61 toward the wall 5 and the substrate 1 so as to form asurrounding portion 62. As shown in FIG. 4, the electrode layer 2 andthe lighting diode 4 are embedded in the package compound 6. Thesurrounding portion 62 has an annular slot formed on a top surface 623thereof, a bottom end 6231 of the annular slot is located at a positionaligning with 25%˜90% of a thickness T of a lighting unit U (e.g., thelighting diode 4 and the submount 7) along a height direction H that isperpendicular to the first surface 11, but the present disclosure is notlimited thereto.

It should be noted that the thickness T of the lighting unit U in thepresent embodiment is defined by a distance from a bottom end of thesubmount 7 to the top surface 41 of the lighting diode 4. In otherwords, the bottom end of the submount 7 is aligned with a positioncorresponding to 0% of the thickness T, and the top surface 41 of thelighting diode 4 is aligned with a position corresponding to 100% of thethickness T.

Specifically, as shown in FIGS. 2 to 4, in each of the dispensingprocesses, the dispenser G starts to output the package compound 6 at afirst position that is about 0.2 mm above the top surface 41 of thelighting diode 4 (as shown in FIG. 2), and then the dispenser Ggradually moves in a direction away from the top surface 41 (an upwarddirection as shown in FIG. 3) until reaching a second position that isabout 0.5 mm above the top surface 41 of the lighting diode 4 (as shownin FIG. 4). Moreover, the dispenser G at the second position stopsoutputting the package compound 6 for 0.3 seconds, but the presentdisclosure is not limited thereto.

As shown in FIGS. 5 and 6, the step S130 is carried out by attaching atop end 51 of each of the walls 5 onto a release film R that is adheredto a first tape T1. The release film R and the first tape T1 in thepresent embodiment can each be a pyrolysis film (or tape), athermal-resistant film (or tape), or a UV film (or tape), but thepresent disclosure is not limited thereto.

As shown in FIGS. 6 and 7, the step S140 is carried out by using a bladeB to slice from the second surfaces 12 of the substrate assembly 10along the first direction D1 (as shown in FIGS. 5 and 6) to form aplurality of rows of the substrates 1 that are separate from each other(as shown in FIG. 7). In other words, the substrates 1 of the substrateassembly 10 are respectively connected along the first direction D1 soas to form the rows of the substrates 1 as shown in FIG. 7, and the rowsof the substrates 1 separate from each other along the second directionD2.

As shown in FIGS. 8 and 9, the step S150 is carried out by attaching thesecond surfaces 12 of the rows of the substrates 1 onto a second tape T2(e.g., adhering the second tape T2 to the solder pad layers 3). Thesecond tape T2 in the present embodiment can be a pyrolysis tape, athermal-resistant tape, or a UV tape, but the present disclosure is notlimited thereto. In other words, the relative positions of the rows ofthe substrates 1 can be effectively maintained by attaching the rows ofthe substrates 1 onto the second tape T2.

As shown in FIGS. 9 and 10, the step S160 is carried out by using theblade B to slice the rows of the substrates 1 from the second tape T2along the second direction D2 so as to form the substrates 1 that areseparate from each other and are in a matrix arrangement as shown inFIG. 10. Specifically, the substrates 1 can be rotated about 90 degreesin the steps S140 and S160, such that the slicing of the step S140 alongthe first direction D1 and the slicing of the step S160 along the seconddirection D2 can be easily implemented by the blade B, but the presentdisclosure is not limited thereto. For example, in other embodiments ofthe present disclosure, the blade B can be rotated about 90 degrees inthe step S160 for easy slicing along the second direction D2.

As shown in FIGS. 11 to 13, the step S170 is carried out by removing thefirst tape T1, the second tape T2, and the release film R to obtain aplurality of LED package structures 100. In the step S170, the releasefilm R is preferably removed after removing the first tape T1 and thesecond tape T2. In the step S170, after the first tape T1 and the secondtape T2 are removed as shown in FIG. 11, a third tape T3 can be attachedonto the second surfaces 12 of the substrates 1 as shown in FIG. 12(e.g., the third tape T3 is adhered to the solder pad layers 3), andthen the release film R is removed to obtain the LED package structures100 as shown in FIG. 13.

Moreover, a pre-process can be implemented on the first tape T1, thesecond tape T2, or the release film R for reducing the adhesion of thefirst tape T1, the second tape T2, or the release film R, such that thefirst tape T1, the second tape T2, and the release film R can be moreeasily removed. For example, the pre-process related to the release filmR includes that the release film R can be heated, irradiated with a UVlight, or contacted with an organic solution, thereby reducing theadhesion of the release film R with respect to each of the walls 5.

In addition, the step S110 can be replaced by step S110′, and the stepS110′ is carried out by providing a carrier module M as shown in FIG.1B. Specifically, a portion of the walls 5 arranged between any twoadjacent lighting diodes 4 can be formed as one piece structure that issliced in the steps S140, S160.

The manufacturing method of the present embodiment has been disclosed inthe above description, and the following description discloses thepackage structure 100 prepared by using the manufacturing method of thepresent embodiment, but the present disclosure is not limited thereto.That is to say, the package structure 100 of the present embodiment canbe prepared by using a method other than the manufacturing method of thepresent embodiment.

As shown in FIG. 14A, the package structure 100 includes a substrate 1,an electrode layer 2, a solder pad layer 3, a lighting unit U, anannular wall 5, and a package compound 6. In the present embodiment, thelighting unit U is a UV lighting unit for example, but the presentdisclosure is not limited thereto. In other embodiments of the presentdisclosure, the lighting unit U can be a laser lighting unit. Theelectrode layer 2 and the solder pad layer 3 are electrically connectedto each other, and are disposed on two opposite surfaces of thesubstrate 1. The lighting unit U is disposed on the substrate 1 and iselectrically connected to the electrode layer 2. The wall 5 is disposedon the substrate 1 and is arranged around the lighting unit U. Thepackage compound 6 is disposed in the wall 5, and the lighting unit U isembedded in the package compound 6. The following description furtherdiscloses the structure and connection relationship of each component ofthe package structure 100.

The substrate 1 in the present embodiment is a ceramic substrate, butthe present disclosure is not limited thereto. The substrate 1 has afirst surface 11, and a second surface 12 opposite to the first surface11. The substrate 1 defines a height direction H perpendicular to thefirst surface 11. The substrate 1 is provided with a plurality ofconductive pillars 13 embedded therein. An end of each of the conductivepillars 13 is exposed from the first surface 11 of the substrate 1, andanother end of each of the conductive pillars 13 is exposed from thesecond surface 12 of the substrate 1.

The electrode layer 2 is disposed on the first surface 11 of thesubstrate 1, and the solder pad layer 3 is disposed on the secondsurface 12 of the substrate Two opposite ends of each of the conductivepillars 13, which are respectively exposed from the first surface 11 andthe second surface 12 of the substrate 1, are respectively connected tothe electrode layer 2 and the solder pad layer 3, such that theelectrode layer 2 and the solder pad layer 3 are electrically connectedto each other through the conductive pillars 13.

The lighting unit U in the present embodiment includes a lighting diode4 and a submount 7. The lighting diode 4 is disposed on the submount 7,and is configured to emit a light having a wavelength within a range of180 nm˜410 nm (e.g., 260 nm˜270 nm, 270 nm˜290 nm, 305 nm˜315 nm, or 320nm˜330 nm), but the present disclosure is not limited thereto. Thelighting diode 4 has a top surface 41 and a surrounding lateral surface42 connected to a peripheral edge of the top surface 41.

Moreover, the lighting diode 4 is disposed above the first surface 11 ofthe substrate 1, and is electrically connected to the electrode layer 2and the solder pad layer 3. The electrical connection manner between thelighting diode 4 and the electrode layer 2 can be adjusted or changedaccording to design requirements. For example, as shown in FIG. 14A, thelighting diode 4 is connected to the submount 7 fixed on the electrodelayer 2 in a flip-chip bonding manner, and the submount 7 iselectrically connected to the electrode layer 2 in a wiring manner(e.g., a normal bonding or a reverse bonding) for establishing theelectrical connection between the lighting diode 4 and the electrodelayer 2.

The wall 5 in the present embodiment can be an aluminum wall or apolymer wall formed on the substrate 1, or the substrate 1 and the wall5 can be integrally formed as a one-piece structure by a hightemperature co-fired ceramic (HTCC) process or a low temperatureco-fired ceramic (LTCC) process, but the present disclosure is notlimited thereto.

The wall 5 is disposed on the first surface 11 of the substrate 1. Thewall 5 and the first surface 11 of the substrate 1 jointly define anaccommodating space S, and the lighting diode 4 is arranged in theaccommodating space S. In other words, a top end of the wall 5 is higherthan the top surface 41 of the lighting diode 4.

The package compound 6 allows light generated by the lighting unit U topass there-through. Specifically, the material of the package compound 6in the present embodiment includes a polydimethylsiloxane (PDMS) or afluoropolymer, but the present disclosure is not limited thereto. Thepackage compound 6 is arranged in the accommodating space S, and theelectrode layer 2 and the lighting diode 4 are entirely (or at leastpartially) embedded in the package compound 6. Moreover, a top end ofthe package compound 6 has a cross section that is in a substantial Wshape (as shown in FIG. 14A), but the package compound 6 of the presentdisclosure is not limited by the present embodiment.

Specifically, the package compound 6 includes an attaching portion 61adhered to the top surface 41 of the lighting diode 4 and a surroundingportion 62 arranged around the attaching portion 61. The top surface 41of the lighting diode 4 is entirely covered by the attaching portion 61.The attaching portion 61 is substantially in a cone shape and has acurved outer surface. A cross section of the attaching portion 61perpendicular to the height direction H gradually becomes bigger in adirection from a top end 611 of the attaching portion 61 toward the topsurface 41 of the lighting diode 4. A height H1 of the top end 611 ofthe attaching portion 61 with respect to the first surface 11 is lowerthan a height H2 of the top end 51 of the wall 5 with respect to thefirst surface 11. In addition, in other embodiments of the presentdisclosure, the height H1 of the top end 611 of the attaching portion 61with respect to the first surface 11 can be higher than a height H2 ofthe top end 51 of the wall 5 with respect to the first surface 11. Thatis to say, the top end 611 of the attaching portion 61 is lower than thetop end 51 of the wall 5, thereby preventing the light-permeable cover 8from pressuring the attaching portion 61.

Moreover, the surrounding portion 62 has an inner annular part 621, anouter annular part 622, and a top surface 623 connecting a top end ofthe inner annular part 621 and a top end of the outer annular part 622.The inner annular part 621 is connected to a peripheral edge of a bottompart 612 of the attaching portion 61 and the surrounding lateral surface42 of the lighting diode 4. The outer annular part 622 is connected toan inner surface of the wall 5, and a height of the outer annular part622 with respect to the substrate 1 is greater than a height of the topsurface of the lighting unit U with respect to the substrate 1. Thesurrounding portion 62 has an annular slot formed on the top surface 623thereof. That is to say, a height of the top surface 623 of thesurrounding portion 62 with respect to the surface 11 of the substrate 1gradually decreases in a direction from the two end of the surroundingportion 62 toward a substantial center thereof.

Specifically, a bottom end 6231 of the annular slot is located at aposition aligning with 25%˜90% of the thickness T of the lighting diode4 and the submount 7 along the height direction H. In other words, in across section of the package compound 6 parallel to the height directionH and passing through the lighting diode 4, a top end of the crosssection of the package compound 6 is in a substantial W shape that isformed by the outer surface of the attaching portion 61 and the topsurface 623 of the surrounding portion 62.

In addition, since the surrounding portion 62 is connected to theperipheral edge of the bottom part 612 of the attaching portion 61, thecurvature of the curved top surface 623 of the surrounding portion 62can be adjusted according to design requirements. In the presentembodiment, the top end 611 of the attaching portion 61 and a top end6221 of the outer annular part 622 of the surrounding portion 62 aresubstantially arranged at the same height with respect to the substrate1, such that the top surface 623 of the surrounding portion 62 can beformed with a larger radius of curvature, but the present disclosure isnot limited thereto. Specifically, a center of curvature of the topsurface 623 is located outside of the accommodating space S. Therefore,light emitted from the top surface 623 of the surrounding portion 62 canbe gathered outside of the wall 5, thereby preventing light spots frombeing formed inside of the wall 5.

Moreover, since the surrounding portion 62 is connected to theperipheral edge of the bottom part 612 of the attaching portion 61, thesurrounding lateral surface 42 of the lighting diode 4 can be entirelycovered by the surrounding portion 62, thereby preventing light leakagefrom the package structure 100. In summary, the package compound 6 inthe present embodiment excludes a configuration where an attachingportion 61 and a surrounding portion 62 are separate from each other. Alighting efficiency of the package structure 100 of the presentembodiment is more than that of another package structure, being withouta W-shaped cross section and having a light-permeable cover 8 coveringthe lighting unit U, by 26%. Moreover, the light-permeable cover 8 canbe prevented from exploding due to an internal air pressure when thepackage structure 100 is heated, so that the reliability of the packagestructure 100 is not affected.

In addition, the inner annular part 621 of the surrounding portion 62 inthe present embodiment is arranged adjacent to and connected to theattaching portion 61, but the present disclosure is not limited thereto.For example, as shown in FIG. 14B, the inner annular part 621 of thesurrounding portion 62 can be arranged adjacent to and spaced apart fromthe attaching portion 61.

Second Embodiment

Reference is made to FIG. 15A and FIG. 15B, which illustrates a secondembodiment of the present disclosure. The second embodiment is similarto the first embodiment, so that the identical features are notdisclosed in the following description. The difference between thesecond embodiment and the first embodiment resides in the lighting unitU. Specifically, as shown in FIG. 15A, the lighting unit U of thepresent embodiment includes only the lighting diode 4, which is directlymounted on the electrode layer 2.

Moreover, as shown in FIG. 15B, the electrode layer 2 (i.e., the pair ofelectrodes 2) can be formed as a leadframe configuration.

It should be noted that the thickness T of the lighting unit U in thepresent embodiment is defined by a distance from a bottom end of thelighting diode 4 to the top surface 41 of the lighting diode 4. In otherwords, the bottom end of the lighting diode 4 is aligned with a positioncorresponding to 0% of the thickness T, and the top surface 41 of thelighting diode 4 is aligned with a position corresponding to 100% of thethickness T.

Third Embodiment

Reference is made to FIG. 16, which illustrates a third embodiment ofthe present disclosure. The third embodiment is similar to the first andsecond embodiments, so that the identical features are not disclosed inthe following description. The difference between the third embodimentand the first and second embodiments is disclosed as follows. Thepackage structure 100 of the present embodiment further includes alight-permeable cover 8 (e.g., a transparent plate). The light-permeablecover 8 is disposed on the top end 51 of the wall 5 so as to enclose theaccommodating space S. That is to say, the light-permeable cover 8 isarranged above the lighting unit U. The lighting unit U can only includea lighting diode 4, or the lighting unit U can include a lighting diode4 and a submount 7. Accordingly, the lighting efficiency of the packagestructure 100 of the present embodiment is more than that of anotherpackage structure mentioned in the first embodiment by 13%. Moreover,since the package structure 100 of the present embodiment is providedwith the package compound 6 having a W-shaped cross section, an externalair in the package structure 100 can be reduced. Accordingly, thelight-permeable cover 8 can be prevented from exploding due to aninternal air pressure when the package structure 100 is heated, so thatthe reliability of the package structure 100 is not affected.

In addition, the light-permeable cover 8 in the present embodiment is aflat plate, but the present disclosure is not limited thereto. Forexample, in other embodiments of the present disclosure, thelight-permeable cover 8 can be a dome lens.

Fourth Embodiment

Referring to FIG. 17, the present embodiment is similar to the secondembodiment, and the similarities between the present embodiment and thesecond embodiment will not be repeated herein. The differences of thepresent embodiment from the second embodiment are mainly as follows.

The package structure 100′ in the present embodiment further includes areflective layer 9 disposed in the accommodating space S, and thereflective layer 9 at least covers a part of the electrode layer 2 andis covered by the package compound 6. Specifically, in a section alongthe height direction H, the reflective layer 9 is contacted the innerside of the wall 5 and a part of the substrate 1 that face the lightingunit U. The reflective layer 9 has a first curved surface 91 that isformed along the inner side of the wall 5 and a part of the substrate 1adjacent to the wall 5, and a center C1 of a curvature (i.e., a circlecenter) of the first curved surface 91 is preferably arranged outside ofthe accommodating space S.

Moreover, a height H3 of the first curved surface 91 relative to thesubstrate 1 is less than or equal to the height H4 (not the thickness T)of the top surface 41 of the lighting diode 4 relative to the substrate1, so that the first curved surface 91 can reflect the light emitted bythe surrounding lateral surface 42 of the lighting diode 4. It should benoted that the height H3 of the first curved surface 91 refers to aheight position of reflective layer 9 along the inner edge of the wall 5in the section along the height direction H. Furthermore, it is worthnoting that in another embodiment of the present disclosure that is notshown, the reflective layer 9 preferably completely covers the electrodelayer 2 so as to avoid the light emitted by the surrounding lateralsurface 42 of the lighting diode 4 be absorbed by the electrode layer 2and the substrate 1.

In addition, the reflective layer 9 in the present embodiment contains aresin 92 and a plurality of reflective particles 93, and the reflectiveparticles 93 are selected from the group consisting of Teflon °,aluminum, and zirconium dioxide (Zr02), but the present embodiment isnot limited thereto. The reflective particles 93 are evenly disposed inthe resin 92. The concentration of reflective particles 93 are within arange from 30 to 50 wt % based on a weight of the reflective layer 9.More preferably, the diameter of each of the reflective particles 93 iswithin a range from 10 μm (micrometers) to 20 μm (micrometers), so thatthe reflective layer 9 has high reflectivity with respect to the lighthaving a wavelength ranged from 200 to 400 μm (micrometers).

In practice, the lighting unit U is arranged at a center of the packagecompound 6 and the surrounding portion 62 is formed symmetrically aboutthe attaching portion, so that the light emitted by the surroundinglateral surface 42 of the lighting diode 4 can pass through the packagecompound 6 and be evenly reflected by reflective layer 9, but thepresent disclosure is not limited thereto.

Moreover, the top surface 623 of the surrounding portion 62 is in acurved shape so as to define as a second curved surface, and a center C2of a curvature (i.e., a circle center) of the second curved surface isarranged outside of the accommodating space. The curvature of the firstcurved surface 91 is preferably greater than the curvature of the secondcurved surface, and the center C1 of the curvature of the first curvedsurface 91 and the center C2 of the curvature of the second curvedsurface is respectively located on a path of the light emitted by thelighting diode 4, so that the light emitted from the top surface 623 ofthe surrounding portion 62 can be gathered outside of the wall 5,thereby preventing light spots from being formed inside of the wall 5.

In addition, Table 1 shows an experimental data of the package structure100′ of the present embodiment obtained through the above-mentionedstructure. Specifically, the Table 1 is a comparison table of thepackage structure 100′ of the present embodiment, the package structure100 of the second embodiment, and two different conventional packagestructures PA, PB under the same service life. The improved light outputrate (mW %) in Table 1 is based on comparing with a package structurethat does not have any package compound. For description, the followingbriefly introduces the structures of the two different conventionalpackage structures PA, PB, and then describes Table 1.

The conventional package structures PA is roughly shown in FIG. 20, andthe feature of the conventional package structures PA is that a convexlens PA1 covers on a lighting unit PA2. The conventional packagestructures PB is roughly shown in FIG. 21, and the feature of theconventional package structures PB is that a lens PB1 is disposed arounda side surface of the lighting unit PB2.

TABLE 1 Present disclosure Conventional technology 100′ 100 PA PB (FIG.17) (FIG. 15A) (FIG. 20) (FIG. 21) Applicable Middle Low Low Low power(5~10 mW) (2 mW) (2 mW) (2 mW) Improved light 22.2% 12% 12% 11% outputrate (mW %)

It can be known from Table 1 above that the package structure 100′ ofthe present embodiment improves the light output rate by 22.2% throughthe above-mentioned structure, and the light output rate of the packagestructure 100′ of the present embodiment is 10% more than the lightoutput rate of each of the conventional package structures PA, PB.Furthermore, when the power of the package structure 100′ of the presentembodiment and the power of the conventional package structures PA, PBare each at middle power (e.g., 5-10 mW), the service life of thepackage structure 100′ is greater than the service life of theconventional package structures PA, PB.

It should be noted that the above-mentioned structure of the presentembodiment can also be applied to the package structure 100 in the thirdembodiment, so that the package structure 100 in the third embodimentcan have the same beneficial effects as the present embodiment.

Fifth Embodiment

Referring to FIG. 18, the present embodiment is similar to the fourthembodiment, and the similarities between the present embodiment and thefourth embodiment will not be repeated herein. The differences of thepresent embodiment from the fourth embodiment are mainly as follows.

The reflective layer 9 in the present embodiment does not have the firstcurved surface 91. Specifically, the reflective layer 9 in the presentembodiment covers the electrode layer 2, and has an inclined surface 94that is formed along the inner side of the wall 5 and a part of thesubstrate 1 adjacent to the wall 5. A height H5 of the inclined surface94 of the reflective layer 9 relative to the substrate 1 is less than orequal to a height H4 of the top surface 41 of the lighting diode 4relative to the substrate 1. The inclined surface 94 has a slope that ispreferably within a range from 15 degrees to 60 degrees. The inclinedsurface 94 can reflect the light emitted by the lateral surface 42 ofthe lighting diode 4 to the outside of the accommodating space S so asto avoid the light from being absorbed by the electrode layer 2 and thesubstrate 1.

Sixth Embodiment

Referring to FIG. 19, the present embodiment is similar to the fourthembodiment, and the similarities between the present embodiment and thefourth embodiment will not be repeated herein. The differences of thepresent embodiment from the fourth embodiment are mainly as follows.

The package structure 100′ in the present embodiment further includes alens unit 8 disposed on a top end 51 of the wall 5. The lens unit 8includes a body 81 and an antireflection layer 82. The body 81 allowslight to pass there-through and has a base portion 811 and a bendingportion 812 connected to the base portion 811. The base portion 811 isdisposed on the top end 51 of the wall 5, the bending portion 812corresponds in position to the lighting diode 4, and two ends of thebending portion 812 correspond in position to the annular slot. Theantireflection layer is arranged on a side surface of the lens unit awayfrom the substrate.

The bending portion 812 is bent outward in a direction away from thesubstrate 1 so as to have a curvature, and the designer can modify thelight type emitted by the lighting diode 4 through adjusting thecurvature of the bending portion 812.

In addition, when the body 81 is disposed on the wall 5, the body 81closes the accommodating space S, so that the accommodating space S isin a sealed state. The accommodating space S is preferably kept in avacuum to prevent moisture from entering the accommodating space S,thereby greatly increasing the service life of the package structure100′, but the present disclosure is not limited thereto. For example,the accommodating space S may also be filled with inert gas.

The antireflection layer 82 in the present embodiment is ananti-reflective coating (i.e., AR), and is arranged on a side surface ofthe lens unit 8 away from the substrate 1. The antireflection layer 82can reduce the total reflection phenomenon caused by the light emittedby the lighting diode 4 entering the outside (e.g., air) from the body81. In other words, the package structure 100′ has more light energy bythe lens unit 8, the reflective layer 9, and the package compound on thesame unit area.

Beneficial Effects of the Embodiments

In conclusion, the package structure and the manufacturing methodthereof provided by the present embodiment can increase the performanceof the package structure (e.g., a lighting efficiency) through theconfiguration of the package compound. Moreover, the manufacturingmethod of the present embodiment can be carried out to effectivelyprevent spattering during a slicing process of the substrate assembly.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A package structure, comprising: a substrate; a pair of electrodes disposed on the substrate; a lighting unit including a light emitting diode disposed on the substrate and electrically connected to the pair of electrodes; a wall disposed on the substrate, wherein the wall and the substrate jointly define an accommodating space, and the lighting unit is disposed in the accommodating space; and a package compound disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound; wherein the package compound has a surrounding portion around a lateral surface of the light emitting diode, and the surrounding portion has a concave top surface with an annular slot formed thereon; wherein a bottom end of the annular slot is located at a position aligning with about 25% to 90% of a thickness of the lighting unit along a height direction perpendicular to a top surface of the lighting unit, wherein a center of curvature of the concave top surface is located outside of the accommodating space such that light emitted from the concave top surface is gathered outside of the wall; wherein the top end of the package compound is exposed to air.
 2. The package structure according to claim 1, wherein the package compound includes no scattering or reflecting particles.
 3. The package structure according to claim 1, wherein the configuration of the package compound allows light emitted from the light emitting diode to leave the package structure through the package compound without being scattered or reflected inside the accommodating space.
 4. T The package structure according to claim 1, wherein a height of a top end of the surrounding portion in contact with the wall is higher than a height of a top surface of the light emitting diode.
 5. The package structure according to claim 1, wherein the lighting unit is arranged at a center of the package compound and the surrounding portion is formed symmetrically about an attaching portion.
 6. The package structure according to claim 1, wherein the package compound includes an attaching portion, and the attaching portion adheres to a top surface of the light emitting diode and contacts with the surrounding portion; wherein a top end of the attaching portion and a top end of the surrounding portion in contact with the wall are substantially arranged at the same height with respect to the substrate.
 7. The package structure according to claim 1, further comprises a light-permeable cover disposed on a top end of the wall.
 8. The package structure according to claim 1, wherein the light emitting diode is configured to emit a light having a wavelength within a range from about 180 nm to 410 nm.
 9. The package structure according to claim 1, wherein the lighting unit includes a submount, and the light emitting diode electrically connects to a pair of electrodes of the submount.
 10. A package structure, comprising: a substrate; a pair of electrodes disposed on the substrate; a lighting unit disposed on the substrate and electrically connected to the pair of the electrodes; a wall disposed on the substrate, wherein the wall and the substrate jointly define an accommodating space, and the lighting unit is disposed in the accommodating space; and a package compound disposed in the accommodating space, wherein the package compound covers the lighting unit, wherein, in a cross section view, the package compound is in a W-shape that includes a convex portion on a top of the lighting unit and two concave portions on lateral sides of the lighting unit, and the two concave portions contact the convex portion; wherein each of the two concave portions has a concave top surface, and a center of a curvature of the concave top surface is arranged outside of the accommodating space; wherein a space is defined between the top surface of the package compound and the wall is hollow.
 11. The package structure according to claim 10, wherein a bottom end of concave top surface is located at a position aligning with about 25% to 90% of a thickness of the lighting unit.
 12. The package structure according to claim 10, wherein the package compound includes no scatting particles or reflecting particles.
 13. The package structure according to claim 10, wherein the configuration of the package compound allows light emitted from the light emitting diode to leave the package structure through the package compound without being scattered or reflected inside the accommodating space.
 14. The package structure according to claim 10, wherein each of the two concave portions has a top end in contact with the wall, and a height of the top end is higher than a height of a top surface of the light emitting diode.
 15. The package structure according to claim 10, wherein the lighting unit is arranged at a center of the package compound, and the two concave portions are formed symmetrically about an attaching portion.
 16. The package structure according to claim 10, wherein a height of a top end of the convex portion with respect to the substrate is less than a height of the wall with respect to the substrate.
 17. The package structure according to claim 10, further comprises a light-permeable cover deposed on a top end of the wall.
 18. The package structure according to claim 10, wherein the light emitting diode is configured to emit a light having a wavelength within a range from about 180 nm to 410 nm.
 19. The package structure according to claim 10, wherein the lighting unit includes a submount, and the light emitting diode electrically connects to a pair of electrodes of the submount. 